Electronic devices and components such as surface-mounted
device units, hybrid integrated circuits, heating coils, embedded inert
devices, and sensors are manufactured using thick-film technology. The principal
manufacturing method is screen printing (stenciling), which, in addition to its
application in the fabrication of electronic devices, can also be employed for
a variety of graphical reproduction purposes.
In the 1950s, it turns among the most important fabrication
techniques for electronic devices/modules.
Thick-film
circuits are extensively used in the automotive sector, both in sensors, e.g.
combination of fuel/air, strain gauges, motor, drive-train controls, and a
sensor for activating airbags. Important is the higher efficiency, invariably
prolonged temperature range also along huge thermocycling without the breakdown
of circuits. Aerospace devices, home appliances, and various sensors are more
applications requiring affordability and dependability.
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The
fabrication of thick film
devices/modules is an advanced technique comprising the screen-printing coating
of multiple subsequent layers of conductive, resistive, and dielectric layers
upon an electrically insulating substrate (Alumina).
As a
low-cost manufacturing technique, it’s ideal for mass production of
isolated devices such as resistors, thermistors, varistors, and combined
inert devices.
Thick film
technology is also an option for hybrid integrated circuits, rivals and
accompanies SMT based on PCB/PWB and thin film technology in electronics
shrinkage (parts/elements/area or volume).
Choose Thick Film Hybrid Circuit Experts
Whether you
require professionals in quality wire bonding or thick film hybrid circuit board
fabrication in the USA, the professional team at Hybrid-Tek will collaborate
with you throughout the entirety of your hybrid project. Their high-quality hybrid
technology can be utilized in a variety of industrial and commercial
applications, including sensor technologies for communications, medical
equipment, and vehicle assembly.
